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- 1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.3mm 1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.3mm
- Description
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Brand new and high quality
Solder tin paste is the best choice of reballing IC
It is used instead of the pin in the IC component package structure
Specification:
Brand: BEST
Model: 505
Material: tin
Diameter: 0.2mm~0.65mm
Flux content: 63%
Melting point: 183°C
Working temperature: 200-380°C
Quantity: 25,000pcs per bottle
Balls alloy: Sn63/Pb37
Size: 35x16mm
Package included:
1 x 1 Bottle Tin BGA Reballing Soldering Balls